I537-2O7-25.000 MHZ

I537 Series Product Features: Applications: TCXO Low Jitter, Non-PLL Based Output Clipped Sinewave Output Compatible with Leadfree Processing Digital Compensation Wireless Communication Test Instruments GPS Base stations Telecommunications Frequency 8.000 MHz to 40.000 MHz Output Level Clipped Sinewave 0.8 Vp-p Min. Output Load 10K Ohms // 10 pF Frequency Stability Vs Temperature Vs Voltage (±5%) Vs Load (±5%) Frequency Tolerance @ 25° C See Frequency Stability Table ±0.3 ppm Max. ±0.2 ppm Max. ±1.0 ppm Max. Aging @ 25° C ±1 ppm / Year Max. Supply Voltage See Supply Voltage Table, Tolerance ± 5% Current 2.0 mA Max. Operating See Operating Temperature Table Storage -40° C to +85° C Phase Noise (Typ. @ 20Mhz) -86 dBc/Hz @ 10 Hz -115 dBc/Hz @ 100 Hz -138 dBc/Hz @ 1KHz -146 dBc/Hz @ 10KHz Recommended Pad Layout Pad Connections Pad/Type Pad 1 Pad 2 Pad 3 Pad 4 TCXO Ground or NC GND Output Supply Voltage (Vcc) Dimension Units: mm Part Number Guide Package Operating Temperature I537 (Clipped Sinewave TCXO) Sample Part Number: I537-1Q3- 20.000 MHz Frequency Stability vs Temperature Supply Voltage Frequency 2 = 2.7 V 7 = 0°C to +50°C **N = ±1.0 ppm 1 = 0°C to +70°C **O = ±1.5 ppm 3 = 3.3 V 3 = -20°C to +70°C P = ±2.0 ppm 6 = 2.5 V 5 = -30°C to +85°C Q = ±2.5 ppm 7 = 3.0 V 2 = -40°C to +85°C R = ±3.0 ppm 8 = 2.8 V -20.000 MHz J = ±5.0 ppm NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. ** Not available for all operating temperature ranges and output frequencies. Revised K: 12/03/20 Page 1 of 2 www.ilsiamerica.com I537 Series Pb Free Solder Reflow Profile: Typical Application: GND or NC *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic; storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metallization). Tape and Reel Information: Quantity per Reel A B C D E F 3000 8 ± 0.3 4 ± 0.2 3.5 ± 0.2 9±1 60 / 80 180 Environmental Specifications: Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance Revised K: 12/03/20 MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Page 2 of 2 www.ilsiamerica.com